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US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor device with active portions of varied widths inside active pattern" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,511, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor device with active portions ... Read More


US Patent Issued to SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY (HANGZHOU) on April 14 for "Trench MOSFET and manufacturing method therefor" (Chinese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,512, issued on April 14, was assigned to SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY (HANGZHOU) Co. LTD. (Hangzhou City, China). "Trench MOSFET... Read More


US Patent Issued to DB HiTek on April 14 for "Semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,513, issued on April 14, was assigned to DB HiTek Co. Ltd. (Seoul, South Korea). "Semiconductor device" was invented by Seung Hyun Kim (Bu... Read More


US Patent Issued to NANYA TECHNOLOGY on April 14 for "Semiconductor device with recessed gate and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,514, issued on April 14, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with recessed gate and me... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 14 for "Semiconductor device structure with inner spacer layer" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,515, issued on April 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device structur... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 14 for "Semiconductor device structure with inner spacer layer" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,515, issued on April 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device structur... Read More


US Patent Issued to STMICROELECTRONICS on April 14 for "Silicon carbide power device with integrated resistance and corresponding manufacturing process" (Italian Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,516, issued on April 14, was assigned to STMICROELECTRONICS S.r.l. (Agrate Brianza, Italy). "Silicon carbide power device with integrated ... Read More


US Patent Issued to FUJI ELECTRIC on April 14 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,517, issued on April 14, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor device" was invented by Keishirou Kumada... Read More


US Patent Issued to FUJI ELECTRIC on April 14 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,517, issued on April 14, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor device" was invented by Keishirou Kumada... Read More


US Patent Issued to ROHM on April 14 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,518, issued on April 14, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device" was invented by Takayuki Osawa (Kyoto, Japan... Read More